Shenzhen Zhongluo Electronics Co.,Ltd.

Number	Parameter		Technical specification	Remarks
1	Layers		1-16
2	Material		FR-4 CEM-3 CEM-1 FR-1	Special materials according to customer requirements
3	Finished board thickness		0.4-6.0MM(15-236mil)
4	Min-core thickness		0.2MM(8mil)
5	Resistance welding bridge		0.076MM(3mil)
6	Copper thickness		HOZ 1OZ 2OZ 3OZ
7	Min.trace width&line space	double layer	0.1MM(4mil)
8	Min.trace width&line space	Multi layer	0.1MM(4mil)
9	Min-hole diameter	Drilling/PTH	∮0.15MM(6mil)
10	Min-hole diameter	Punching	∮0.7MM(28mil)
11	Dimension tolerance	Hole position	±0.05MM(±2mil)
12		（W）Width	±20%	Special case±10%
13		（H）Hole diameter	PTH±0.076MM(±3mil)
14		（H）Hole diameter	NPTH±0.05MM(±2mil)
15		Outline dimension	0.1MM(4mil)
16		Conductors&Outline	0.20MM(8mil)
17		Warp and Twist	0.75%
18	Surface treatment		HAL&Lead Free HAL AU/NI Immersion gold/Immersion sliver/Immersion Tin OSP	OSP （+Immersion gold，+gold finger，no peel）
19	ET	Number of tests （MAX）	ET machine:12288 point；
		Insulation resistance testing（MAX）	50MΩ
		Conduction resistance test（MIN）	ET machine：20Ω
		Testing the size of PAD（MIN）	0.25MM(10mil)
		Welding test plate of center distance（MIN）	0.2MM(8mil)
		Testing Voltage（MAX）	500V
		High Voltage test voltage（MAX）	5000V
		High voltage test leakage voltage（MIN）	10uA
		Testing the size of PCB	450*965MM
		Testing the thickness of plating	0.4-6.0MM(15-236mil)